Connected MCUs incorporate Wi-Fi 6/6E, BLE 5.4

A new family of connected MCUs incorporating long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 is targeted at cost-optimized, power-efficient, and small form-factor products for smart home, industrial, wearables, and Internet of Things (IoT) applications.

These connected MCUs can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications. They are available in three versions: CYW55913 for tri-band (2.4/5/6 GHz), CYW55912 for dual-band (2.4/5 GHz), and CYW55911 for single-band (2.4 GHz) support.

AIROC CYW5591x connected MCUs feature extensive peripherals and GPIO support. Source: Infineon

Infineon’s new connected MCUs—also touted as Wi-Fi 6 system-on-chips (SoC)—are built around Arm Cortex M33 192-MHz processor and a TrustZone CC312 security subsystem to provide root of trust (RoT) and cryptographic services. Moreover, its quad-SPI with XIP facilitates on-the-fly encryption/decryption for flash and PSRAM.

On the wireless front, these connected MCUs operate at up to +24 dBm transmit power for Wi-Fi and are optimized with up to +19 dBm transmit power for Bluetooth Low Energy 5.4, which supports Bluetooth low energy 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for LE Long Range.

These connected MCUs also offer easy-to-use software development platform comprising ModusToolbox software, RTOS and Linux host drivers, a fully-validated Bluetooth stack and multiple sample code examples, and Matter software enablement.

Wireless module suppliers like AzureWave, Murata, and USI are starting to incorporate Infineon’s new AIROC CYW5591x connected MCUs into their modules. Infineon is already sampling these Wi-Fi 6 SoCs to alpha customers.

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