Let’s take them in reverse order…
5. NXP and Vanguard to build fab in SingaporeVanguard International Semiconductor Corp, the Taiwan foundry, and NXP are to create a manufacturing jv called VisionPower Semiconductor Manufacturing Company Pte Ltd (“VSMC”) which will build a new 300mm semiconductor wafer manufacturing facility in Singapore. The fab will support 130nm to 40nm mixed-signal, power management and analog products, targeting the automotive, industrial, consumer and mobile end markets. The underlying process technologies are planned to be licensed and transferred to the joint venture from TSMC.
4. Rapidus and IBM hook up on chiplet packagingRapidus, the Japanese startup developing a 2nm manufacturing process, and IBM are to establish mass production technologies for chiplet packaging. Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies aim to work together on further innovation. “We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain,” says Rapidus CEO Atsuyoshi Koike.
