Electronics

SEMICON West 2024 “Stronger Together” Member Preview

SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration and it carries through to this flagship event. From July 8-11, 2024 join us in San Francisco at the Moscone Center for insights into semiconductor industry market trends and to learn more about critical industry issues, including supply chain resilience, heterogeneous integration, cybersecurity, sustainability, and workforce development. You’ll also get a glimpse of what to expect for SEMICON West 2025 when the show moves to Phoenix, AZ. 

3D InCites will be podcasting at the Media Hub. You can’t miss it – it’s right at the bottom of the Moscone North escalator. Be sure to stop by and say hello to Francoise and check out the action. Registration for SEMICON West is open. 

SEMICON West 2024SEMICON West 2024
You’ll find the 3D InCites Podcast Station in the Media Hub in North Hall, across from the Keynote Stage.

 

With more than 20 3D InCites members (including SEMI) exhibiting, presenting, and participating in this year’s event, we expect SEMICON West 2024 will be one to remember. You’ll find a full list of 3D InCites member booths at the bottom of this page.  

Here are the highlights of some of our member events: 

Tim Archer, President and CEO of Lam Research will deliver a Fireside Chat keynote on Tuesday, July 9 from 10:30-11 a.m. at the Keynote Stage, North Hall, Room 24.

Mike Wilson, Executive Vice President of DSV, will also present a keynote. Titled The Changing Dynamic in Global Supply Chains, Mike’s keynote will take place on Wednesday, July 10 from 1:30-1:55 p.m. at the Keynote Stage, North Hall, Room 24.

Sandra Mahadwar, Chief Inclusion & Diversity Officer for KLA, will present a Fireside Chat keynote, Advocating for Real Change: Why Inclusion and Belonging Need to be Everyone’s Concern, on Wednesday, July 10 from 10:35-11:05 at the Keynote Stage, North Hall, Room 24. 

Nordson TEST & INSPECTION will highlight its WaferSense semiconductor sensors, Quadra Pro Manual X-Ray System (MXI), and Gen 7 Acoustic Micro Imaging (AMI) system at booth 1233. Nordson will also unveil its SpinSAM AMI in a video presentation for the first time at the show.

Heidenhain Corporation will showcase its MULTI-DOF technology, CHARON2 motion system platform, and its PP 6000 encoder at booth 6454.

Check out our members at these other events as well. 

Advanced Packaging for Sustainable Additive Manufacturing Innovations

Wednesday, July 10 from 11:30 a.m. – 12:15 p.m. 
Location: 11:30 a.m. – 12:15 p.m. PDT
ASE Group: C.P. Hung

FLEX Panel Discussion: Enabling the Future of Electronics

Wednesday, July 10 from 5:30 – 6:30 p.m.  
ASE Group: C.P. Hung

Heterogeneous Integration Forum Reception

Wednesday, July 10 from 5:30 – 6:30 p.m.  
Location: Moscone South, Exhibition Level Room 8
Sponsored by ASE Group 

Tips for Building a Successful Career – What Isn’t Taught in School

Wednesday, July 10 from 1:30-2:25 p.m.  
Location: Workforce Development Pavilion Stage – North Hall
Cadence: KT Moore 

Scalability and Growth with Logistics

Wednesday, July 10 from 1:20-1:40 p.m.  
Location: Moscone North, Lower Lobby, Room 20
DSV: Niels Larsen

The Changing Dynamic in Global Supply Chains

Wednesday, July 10 from 1:30-1:55 p.m. 
Location: Keynote Stage, North Hall, Room 24
DSV: Mike Wilson 

Harnessing Digital Technology to Create the Transparent Supply Chain of the Future

Thursday, July 11 from 12:40-1 p.m. 
Location: Moscone South, Exhibition Level Room 8
DSV Global Transport and Logistics: Christopher Helgeson 

SEMI VetWorks: Diversity through Military Hiring

Tuesday, July 9 from 3:30 – 4:15 p.m.
Location: Workforce Development Pavilion Stage – North Hall
Edwards Vacuum: Alexis Rose 

Women In Technology Reception

Tuesday, July 9 from 4-5 p.m.
Sponsored by Edwards Vacuum 

A Day in the Life

Wednesday, July 10 from 10:30-10:55 a.m.
Location: Workforce Development Pavilion Stage – North Hall
Edwards Vacuum: Najwa Khazal

Handprint Case Study – Edwards

Thursday, July 11 from 11:20-11:35 a.m.
Location:  Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Edwards Vacuum: Chris Jones

Cryogenic Wafer-Scale Characterization of Superconducting Resonators for Improved Fabrication Yield

Wednesday, July 10 from 2-2:15 p.m. 
Moscone South, Exhibition Level Room 9
FormFactor Inc.: Brandon W. Boiko 

Advanced Probe Card Solutions to address HBM wafer and stacked die test challenges

Thursday, July 11 from 10:15-10:30 a.m.
Location: Moscone South, Exhibition Level Room 9
FormFactor Inc.: David S. Cooke

Risk Mitigation Strategies for mmWave Production Test Environments

Thursday, July 11 from 1:45-2 p.m. 
Location: Moscone South, Exhibition Level Room 9
FormFactor: Ryan Garrison

Future of Computing Challenges and Opportunities

Tuesday, July 9 from 11:20-11:40 a.m. 
Location: Moscone South, Exhibition Level Room 11
IBM: James Sexton

Transforming by Data Modernization, Deploying Data Fabric and AI/ML for Advanced Packaging & Test

Wednesday, July 10 from 12-12:20 p.m.
Location: South Hall, Expo Floor, Smart Manufacturing Pavilion Stage
IBM: Megan K. Arp 

Assuring Cybersecurity Resilience Through Partnership  (Presentation Title TBD)

Wednesday, July 10 from 1:45-2 p.m. 
Location: Moscone South, Exhibition Level, Room 11
IBM: Mukesh Khare, Ph.D. 

Quantum for Semi: Applying Quantum Computing to Semiconductor Challenges

Wednesday, July 10 from 2-2:15 p.m. 
Location: Moscone South, Exhibition Level Room 11
IBM: Charles Chung

Networking and Reception

Wednesday, July 10 from 4:30– 5:30 p.m. 
Location: Moscone South, Exhibition Level, Room 11
IBM: Jennifer Lynn (Panelist) 

Smart Mobility: Chiplets for Automotive Welcome Remarks

Wednesday, July 10 from 10:30-10:35 a.m. 
Location: Smart Mobility Theater, Moscone South, Exhibition Level, Hall C
KLA: Kara Sherman
Closing remarks from 12:15-12:30 p.m. 

Fireside Chat: Advocating for Real Change: Why Inclusion and Belonging Need to be Everyone’s Concern

Wednesday, July 10 from 10:35-11:05 a.m. 
Location: Keynote Stage, North Hall, Room 24
KLA: Sandra Mahadwar

Delivering Smart Manufacturing Value in Semiconductor Assembly

Wednesday, July 10 from 11:40 a.m. – 12 p.m. 
Location: South Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Kulicke & Soffa Industries, Inc.: Shawn Sarbacker 

Fireside Chat

Tuesday, July 9 from 10:30-11 a.m 
Location: Keynote Stage, North Hall, Room 24
Lam Research: Tim Archer 

Panel: Using Data & AI as a Tool to Streamline Assessments & Navigate Complexity

Tuesday, July 9 from 10:50-11:30 a.m. 
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Lam Research: Jami Haaning 

One Digital Twin for Semiconductor Manufacturing? Semiverse™ Solutions & Building the Digital Family

Tuesday, July 9 from 11:05 – 11:25 a.m. 
Location: South Hall, Expo Floor, Smart Manufacturing Pavillon Stage
Lam Research: Joseph Ervin

300mm MEMS – (Al)ready and Waiting

Wednesday, July 10 from 3:10-3:35 p.m. 
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Lam Research: Michelle M. Bourke 

Patterning Solutions to Break Stochastic Tradeoffs

Thursday, July 11 from 11:35-11:55 a.m. 
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Lam Research: Rich Wise, Ph.D. 

Panel: How to Build Employee Impact

Thursday, July 11 from 3-3:30 p.m.
Location: Sustainability Pavilion, Moscone South, Exhibition Level, Room 5
Moderated by Wojtek Osowiecki: Lam Research 

Breathing New Life into Electron-Beam Lithography

Thursday, July 11 from 2:15-2:35 p.m. 
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Multibeam: David K. Lam, Ph.D. 

Innovating the Future: Automated Precision Fluid Dispensing in Panel-Level Packaging

Wednesday, July 10 from 3:10-3:35 p.m. 
Location: South Hall, Expo Floor, Smart Manufacturing Pavillon Stage
Nordson Electronics Solutions: Alec Paul P. Babiarz 

Achieving Zero Defect Manufacturing in Semiconductor Fabs

Wednesday, July 10 from 11-11:20 a.m.
Location: South Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Onto Innovation: Prasad L. Bachiraju 

Using Deep Learning ADC for Defect Classification for Automatic Defect Inspection

Thursday, July 11 from 2:35-2:55 p.m. 
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Onto Innovation: Bryce Chi 

Smart Manufacturing Session 1: Digital Twins for Design & Manufacturing

Tuesday, July 9 from 10:30 a.m. – 12:45 p.m. 
Moderated by Ranjan Chatterjee: PDF Solutions

Empowering the Smart Manufacturing Citizen Data Scientist

Tuesday, July 9 from 11:45 a.m. – 12:05 p.m. 
Location: South Hall, Expo Floor, Smart Manufacturing Pavillon Stage
PDF Solutions: Alan Weber

CEO Summit: Investing in America’s Manufacturing Future

Tuesday, July 9 from 8:30 a.m. – 3:30 p.m. 
Welcome remarks from Joe Stockunas, President of SEMI Americas 
Opening remarks from Ajit Manocha, President and CEO of SEMI 

Fireside Chat: Securing Critical Supply Chains for the 21st Century

Tuesday, July 9 from 2:25 p.m. – 2:50 p.m.

Location: CEO Summit Stage, North Hall, Room 24
SEMI: Joe Stockunas 

Beyond Tier Mapping – Creating a Robust and Resilient Supply Chain Risk

Wednesday, July 10 from 1:30-1:55 p.m. 
Location: CEO Summit Stage, North Hall, Room 24
Moderated by Bettina Weiss from SEMI

ML-based Virtual Metrology for Advanced Process Control for Improved High-Product  Mix Manufacturing

Tuesday, July 9 from 2:50 p.m. – 3:10 p.m.
Location: South Hall, Expo Floor, Smart Manufacturing Pavillon Stage

Siemens Digital Industries Software: Srividya Jayaram  

Achieving single suspect chain diagnosis in the age of backside power

Wednesday, July 10 from 11:20-11:35 a.m. 
Location: Moscone South, Exhibition Level Room 9
Siemens Digital Industries Software: Jayant C. D’Souza 

Hybrid AI to de-risk Drug Development

Thursday, July 11 from 2:35-2:55 p.m.
Location: Smart MedTech Theater, Moscone South, Exhibition Level, Hall C
Siemens Digital Industries Software: Urmi Sen  

SEMICON West and FLEX Conference Welcome Reception

Monday, July 8 from 5:30-7 p.m. 
Moscone South, Upper Lobby
Sponsored by YES and others


Source link

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button
Translate »