GEL 50TBL (TBL – thin bond line) offers 5W/m.K bulk thermal conductivity and, “at a minimum bond line thickness of 0.05mm, the apparent thermal conductivity exceeds 10W/m.K”, according to the company. However, “the material is primarily for thin bond lines and is not typically intended for use as a filler in gaps larger than 0.50mm”.
No mixing nor secondary curing is needed, and rework is possible. Compressive force required to conform the gel during assembly is deliberately low to minimise stress on components, solder joints and leads, although the formulation is intended to stop pump-out caused by temperature fluctuations.
A flow of 25g/min is possible with a 30cm3 syringe (2.5mm orifice at 621kPa), and the material is available in syringes, cartridges and pails (photo) between 10cm3 and 2.5 litre.
Electrical properties include: 200Vac/mm dielectric strength, 1014Ωcm volume resistivity (ASTM D257), a dielectric constant of 7.0 at 1MHz (ASTM D150) and a 1MHz dissipation factor of 0.002.
Operation is possible over -55 to +200°C.
Applications are foreseen in automotive ECUs (electronic control units), telecommunications base stations, consumer electronics and power supplies, with power semiconductors, LEDs, microprocessors and graphics processors.
GEL 50TBL thermal interface material web page
Chomerics is a division of Parker Hannifin, and part of the Engineered Materials Group.
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