Electronics

Community Member Monthly News – October

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October flew by and our community members were busy…

Deca was the recipient of the prestigious IMAPS Corporate Recognition Award in San Diego for its significant technical contributions to the microelectronics industry. Robin Davis, Sr. Director of Business Development at Deca, was also recognized with the impressive IMAPS Emerging Leadership award.

Onto Innovation hosted the Boston Chapter of the Society of Women Engineers (SWE Boston) at its headquarters in Wilmington, Massachusetts. This group of women spent an informative evening on career exploration where company representatives provided insight into life at Onto and the semiconductor industry. They also enjoyed a walk-through experience of our clean room. During dinner, Danielle Baptiste, vice president and general manager of the enterprise business unit, took the floor as the keynote speaker for the evening.

AT&S in Austria was recognized by futurezone.at TECHNOLOGY NEWS as one of the European hotspots driving innovative manufacturing of printed circuit boards and specialized components for microchips used in smartphones, cars, high-performance computers and medical devices, among many more technologies.

Amkor opened its newest factory in Bac Ninh, Vietnam. The Vietnam campus is poised to become Amkor’s most extensive facility, occupying a substantial 57-acre expanse within the Yen Phong 2C Industrial Park. Upon completion, it will feature 200,000 square meters of cleanroom space.

At the OCP Summit 23, ASE’s Lihong Cao opened the show after which Bapi Vinnakota directed the audience to check out all the demos within the first ever open chiplet economy experience center. Between workflow, IP, and chiplets for AI and HPC applications, ASE collectively demonstrated that the chiplet era has well and truly arrived and the critical role of advanced packaging is clear.

Siemens Digital Industries Software unveiled Tessent™ RTL Pro, an innovative software solution developed to help integrated circuit (IC) design teams streamline and accelerate a broad array of critical design-for-test (DFT) tasks for their next-generation designs.

During CadenceCONNECT in Austin, Cadence Design Systems unveiled the future of automotive design with its full-flow AI-based solutions, from chips to systems. Keynote speaker Jason Jones from Texas Instruments and esteemed guests Zak Brown and Oscar Piastri from McLaren Racing put the spotlight on the Cadence CFD solution Fidelity and AI in F1.

Experts from Fraunhofer IZM showcased cutting-edge innovations in flexible, stretchable, and textile-integrated technologies during the TechBlick Lab Tour this week. The event featured a comprehensive exploration of six state-of-the-art laboratories, where 30 external guests of this research area had the opportunity to witness Fraunhofer IZM’s groundbreaking capabilities and to network with industry experts.

Cadence Design Systems announced that RealTek successfully achieves working silicon by adopting the Tempus Timing Solution for N12 design and realizes up to two times improved productivity, with 50 percent reduction in design closure turnaround time and compute/memory costs.

ERS participated in China Semiconductor Packaging and Testing conference (CSPT2023), co-exhibiting with Extripod Electronics Technology Limited, bringing with them a diverse and extensive range of advanced packaging solutions, including its debonding and warpage handling solutions.

AT&S welcomed the Chief Minister of Kedah, Yang Amat Berhormat Dato’ Seri Muhammad Sanusi and his delegation to the fast-growing construction site of AT&S Malaysia in Kulim and provided them the first-hand experience of the Kulim Project. Announced as the largest investment by far for AT&S, Mr. Ingolf Schroeder, EVP and Member of the Board for AT&S Business Unit Microelectronics, Mr. Vittorio Villari, AT&S Malaysia Managing Director, and Mr. Markus Sterba, AT&S Malaysia Technical Project Director, jointly briefed him regarding the progress of Kulim Project with a site tour.

Cadence Design Systems and CEVA, Inc. announced that Cadence has completed its acquisition of Intrinsix Corporation from CEVA. The purchase brings Cadence a highly skilled engineering team with expertise in advanced nodes, radio frequency, mixed-signal and security algorithms, scaling Cadence’s system and IC design services team and expanding Cadence’s reach in key high-growth verticals, including aerospace and defense.

Siemens Digital Industries Software and CEA-List, a technological research institute focused on smart digital systems research, announced the signing of a memorandum of understanding to collaborate on research to further extend and enhance digital twin capabilities with artificial intelligence (AI) and explore greater integration of embedded software on both virtual and hybrid platforms.The research collaboration will bring together the two organizations’ combined industry expertise with the Siemens Xcelerator portfolio and CEA-List’s toolset to help break down the barriers between electronics design, software development and mechanical engineering disciplines using digital twin technologies.

Siemens Digital Industries Software is bringing AI assisted design and greater cloud-based collaboration Solid Edge 2024® software, product design and engineering software for the mainstream and part of the Siemens Xcelerator portfolio of industry software. The latest updates enable manufacturers of all sizes to begin or expand their digital transformation strategy, reuse data more efficiently and to drive innovation at the front-end of mechanical and electrical design and manufacturing through new applications of artificial intelligence in product design, greater cloud-based data sharing and collaboration.

Cadence Design Systems partnered with Rise Against Hunger to pack 43,200 meals, helping to sustain 200 children for an entire year at school. Rise Against Hunger is a rising global movement to end hunger by uniting communities, changing lives and responding to emergencies.

 

Career Opportunities

Amkor Technology, Inc. is currently looking to hire a Sr. Manager, Flip Chip CSP (fcCSP) for its corporate office in Tempe, AZ. The primary functions of this position are to develop robust flip chip product assembly engineering services and drive profitable business growth for your assigned customer base.

Onto Innovation is hiring:

UX Designer (Contract Role) in Wilmington, Massachusetts.

Technical Product Support Engineer (Semi-conductor) in Wilmington, Massachusetts.

Senior Technical Program Manager, Hardware in Wilmington, Massachusetts.

 

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