IFTLE 592: DIBC Hosts Advanced PCBs and Electronic Substrates Industry Day

In early April the Defense Industrial Base Consortium (DIBC) held an “Industry Day for Advanced Printed Circuit Boards (PCBs) and Electronic Substrates” at the IPC APEX Expo.

Let’s look at the “Advanced Printed Circuit Boards and Substrates Industry Day” presentation by

DIBC Presenter, Dr. Korine DuvalDIBC Presenter, Dr. Korine Duval
Dr. Korine Duval

Korine Duval, Ph.D., Microelectronics Sector Lead for the Innovation Capability and Modernization office.

Many of you have shared with me that you appreciate seeing how the different departments of the U.S. Government interrelate, especially since many of them have started financially supporting advanced packaging.

Figure 1 depicts the technology readiness level (TRL) supported by various US Government programs.

Figure 1: Technology readiness levels of U.S. Government microelectronics programs.

OUSD (R&E) = Office of the Under Sect of Defense (Research & Engineering)
OUSD (A&S) = Office of the Under Sect of Defense ( Acquisition & Sustainment)
DoC = Dept of Commerce

While most of you have heard of DARPA and ManTech, you’re probably less familiar with Trusted & Assured Microelectronics (T&AM), which, for instance. is the home of the SHIPS, STEAMPIPE, and STAMP programs. We also see that T&AM and IBAS are both divisions of OUSD.

IBAS ProgramIBAS Program
Figure 2: In the IBAS program, a federated approach.

Defense Industrial Base Consortium (DIBC)


To coalesce and expand the defense industrial base (DIB) in support of the Manufacturing Capability Expansion & Investment Prioritization (MCIEP) critical subsectors. MCIEP is focused on addressing defense supply chain issues, developing the industrial workforce, sustaining critical production, commercializing R&D efforts, and rapidly scaling emerging technologies to build a robust, resilient DIB.

Critical Sectors:

Kinetic capabilities (hypersonics), energy storage and batteries, microelectronics, castings & forgings, strategic and critical materials, and workforce development.


To deliver a resilient US supply chain and workforce able to respond in times of national security crisis without reliance on foreign sources.

Advanced PCBs and Substrates

Technical Element 1: Ultra high-density Interconnects & Organic Integrated Circuit Substrates

Prototype the development of domestic sources for PCBs and/or organic IC substrates that have approximately ≤75μm microvias, ≤50μm traces and spaces, and ≤50μm dielectric thickness and expand domestic capability and capacity to produce such products. This can include investments in prototyping various semi-additive process capabilities and capacities, building on those delivered by traditional subtractive processes.
Reliable medium volume 25-65 μm lines/spaces
High reliability in ≥ 3 layers of stacked microvias
BGA pitch ≤ 0.3 mm
High-frequency applications (50 Ghz and above)
Industrial standards for high-reliability applications of UHDI products (design and performance)
Reliability data to support new designs and materials
Facilities, Equipment, Materials and Processing
Clean rooms / minimize particulates in air, chemistry, equipment
Automated material handling throughout manufacturing
Laser drill < 50 μm diameter capability
Direct imaging <= 20 μm line and space capability
AOI capability <= 20 μm line and space capability
Electrical test <= 0.3 mm pitch capability
Specialized via fill plating equipment
Advanced materialsThin copper foils, advanced laminates, build-up films, thin electroless copper, high-resolution photoresists, via fill chemistry, low etch rate oxide and etching, high-resolution solder masks

Semi-additive processes (SAP) and modified SAP (mSAP)

Technical Element 2: Domestic Sourcing for Enabling Materials for Manufacturing

Prototype state-of-the-art capabilities to enable the development of advanced materials for DoD applications (copper foils for modified semi-additive applications, build-up film equivalents, advanced laminates for organic IC substrates, and solder masks for organic substrate applications.)

Technical Element 3: Improved Microvia Reliability

Prototype new models for improving microvia reliability across various manufacturing sources. Develop and validate design rules and process parameters that yield stable/reliable results on current and emerging HDI, UHDI, and/or organic IC substrate technologies. This could involve a detailed design of experiments (DOE) involving printed board designers, manufacturers, process equipment, chemistry, and materials suppliers

Technical Element 4: HDI/UHDI Reliability Data

Develop and prototype standards and test methods that assess the reliability characteristics of design rules, materials, and processes for HDI, UHDI and/or organic IC Substrate features. Other prototyping and test efforts could include sponsored and comprehensive highly accelerated stress testing of HDI and UHDI structures to assess long-term operational reliability in high-stress environments. Test requirements should be incorporated into relevant industry and DoD requirements and documents.

The U.S. Government is accepting proposals for Advanced PCBs and Substrates based on these elements and will perform technical evaluations of all that are submitted. If selected for an award, the submitter will be asked to provide a statement of work (SOW) and cost proposal.

For all the latest in Advanced Packaging, stay linked to IFTLE

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