Fraunhofer IZM Joins Forces with Rapidus for High-End Performance Packaging- 3D InCites

Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules.

Figure 1: Rapidus high-performance computing module. Figure 1: Rapidus high-performance computing module.
Figure 1: Rapidus high-performance computing module.

Rapidus is building a fab on the island of Hokkaido to manufacture 2nm nodemicrochips and the related high-end performance package. METI, Japan‘s ministry ofeconomy, trade and industry, approves Rapidus‘ plan for research and development of2nm generation semiconductor integration technology for 2024. Thus, FraunhoferIZM is happy to announce this corporation for one of the most important topics in thenear future, realizing modules for e.g. 5G communications, autonomous driving, orhigh-performance computing.

“In March, we had a very inspiring meeting with Rapidus‘ president, Dr. Atsuyoshi Koike, in which he clearly emphasized the importance, not only of developing the most advanced node chip technology but also a highly advanced packaging technology to enable overall best-in-class performance,” said Dr. Michael Schiffer, project leader at Fraunhofer IZM, ” I‘m really looking forward to a fruitful cooperation with a fullcommitment by everyone involved!“


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